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Crypto thief Paul Vernon behind Crypty scam found running new scam - China and US now united against the criminal

 The notorious crypto scammer behind the Cryptsy and Altilly exit scams has resurfaced under a new identity. This time, he operated as “Karl” from Xeggex, another fraudulent exchange that has now collapsed. Thanks to the efforts of the crypto community, he appears to have finally been tracked down—despite the FBI and U.S. authorities failing to bring him to justice.

- Who Is He?

Paul Vernon, also known as "Michael O’Sullivan" or Karl, has a long history of crypto fraud:

• Cryptsy (2016) – Feds: Cryptsy Founder Stole Millions in Users' Cryptocurrency
  Federal authorities report that Paul Vernon orchestrated a "sophisticated theft scheme" between 2013 and 2015. Stole over $9M before fleeing to China. (The estimated total of misappropriated crypto has now surpassed $1billion.)
• Altilly (2020) – Orchestrated a fake exchange hack, stealing $3.3M+.
• Xeggex (2022–2024) – Followed the same pattern before shutting down.

What Happened with Xeggex?

Xeggex started as a seemingly legitimate exchange, offering free listings to attract users. However, things took a turn when:

• The platform claimed a Telegram hack.
• Then reported database corruption.
• Finally, announced missing funds, with all major assets gone.

Now, Vernon is erasing traces of himself. 

BREAKING: We Found Him 

Investigators have located his mansion in Dalian, China. He is reportedly using fake passports from Ecuador and Vanuatu under the name Michael O’Sullivan. The FBI and U.S. Marshals have been informed, and discussions with U.S. authorities are underway. 

🔗 Full Investigation & Evidence (Live Updates):
👉 Click here

How You Can Help

• If you lost funds, track Xeggex wallets and report them to major exchanges.
• Share this with crypto communities to warn others.
• If you have law enforcement or journalist contacts, help bring attention to this case.

The fight against crypto fraud continues—let’s make sure Vernon doesn’t escape justice again. This time we cannot let him escape and continue the cycle of fraud and theft without punishment, destroying the lives of many people.

All but one of the 17 charges against Vernon carry maximum prison sentences of 20 years, according to the indictment, which has been embedded at the end of this article.

Sources: 🚨 Paul Vernon (Cryptsy, BiteBi9, Altilly, Xeggex) – Serial Crypto Scammer and Wanted Fugitive Exposed! 🚨 : r/Bitcoin 

miaminewtimes.com/news/cryptsy-paul-vernon-stole-millions-cryptocurrency-13799886

LPPDR6 CAMM2 CAMM2will pave the way for the end of conventional dGPUs.

Compact, efficient, durable, and excellent value for money; In recent years, integrated GPUs (iGPUs) have made significant strides, thanks to advancements in semiconductor manufacturing and memory technology. Companies like Apple, Intel, and AMD have pushed the boundaries of iGPU performance, driven by:

• TSMC's advanced lithography: Enabling denser chip designs with higher performance within a limited power budget (TDP).
• Memory innovations from Samsung, SK Hynix, and Micron: Delivering faster memory technologies with increased bandwidth to feed these powerful iGPUs.
• GPU Architectural improvements, including advanced data management and compression techniques. More robust APIs like DX12 and Vulkan also come into play here.

Apple has taken a bold approach, dedicating significant silicon real estate and employing high-bandwidth memory (8 memory channels, 256/196-bit bus) to achieve performance levels comparable to mid-range dedicated GPUs (dGPUs) like the NVIDIA GeForce RTX 4070 or AMD Radeon RX 7800XT. However, this approach comes at a high cost, exceeding even the most expensive mobile dGPUs (like the NVIDIA GeForce RTX 4090 Mobile). Furthermore, Apple's ecosystem limitations restrict flexibility and customization compared to Windows systems. It won't be everyone's cup of tea.

Intel and AMD, targeting a broader market, focus on more accessible solutions ranging from budget-friendly handhelds to premium laptops. This necessitates a more balanced approach, limiting the use of expensive, high-bandwidth memory configurations. Currently, they primarily rely on dual-channel LPDDR5X with up to 8000MHz, resulting in a theoretical maximum bandwidth of around 128 GB/s – comparable to a dGPU like the AMD Radeon RX 6500 XT. This bandwidth limitation restricts the performance potential of iGPUs with more than a few hundred shaders. For example, AMD iGPU with 16 compute units (RX 890M) may not deliver the expected performance due to insufficient bandwidth.

LPDDR6 promises to revolutionize iGPU performance. With a single CAMM2 LPDDR6 module offering a 192-bit bus, theoretical bandwidth can reach approximately 322 GB/s:

• Bits to bytes conversion: 192 bits / 8 bits/byte = 24 bytes
• Transfer rate calculation: 14,400,000,000 transfers/second * 24 bytes/transfer = 345,600,000,000 bytes/second
• Conversion to gigabytes per second: 345,600,000,000 bytes/second / 1,073,741,824 bytes/GB ≈ 322 GB/s

This represents a 2.5x improvement in theoretical bandwidth, potentially enabling iGPUs in mainstream notebooks and handhelds to rival popular dGPUs like the NVIDIA GeForce RTX 4060 or AMD Radeon RX 7600XT. The technology behind it;

 The JEDEC JC-45 Committee is actively developing two groundbreaking memory module technologies: a new Tall MRDIMM form factor and a next-generation CAMM module for LPDDR6.

The Tall MRDIMM aims to significantly increase memory bandwidth and capacity by allowing for twice the number of DRAM single-die packages on the module without requiring 3D stacking. This innovative approach leverages a taller form factor while maintaining the existing DRAM package.

Complementing this, JC-45 is developing a cutting-edge CAMM module specifically designed for LPDDR6 operation at speeds exceeding 14.4 GT/s. This advanced module will feature a 24-bit subchannel, a 48-bit channel, and a connector array.

Both these projects are crucial for advancing memory technology and are currently under development within the JC-45 Committee. JEDEC strongly encourages industry participation to shape the future of memory standards. Membership provides valuable benefits, including access to pre-publication proposals and early insights into critical projects like MRDIMM and the next-generation CAMM.

Source: JEDEC Unveils Plans 

Lenovo takes the lead, debuting LP-CAMM2 modules

 Tech Advancements:

Dell's development of the CAMM memory spec, donated to the JEDEC memory standard committee, laid the groundwork for innovations seen in the ThinkPad P1 Gen 7. The CAMM spec aims to shrink standard memory form factors while optimizing communication pathways between memory and host systems, leading to improved performance and efficiency. Third-party manufacturers like Adata have already demonstrated modules following the CAMM spec, with Samsung recently unveiling its initial CAMM-based products, signaling a new era in memory technology.

Lenovo Unveils ThinkPad P1 Gen 7: A Leap Forward in Laptop Innovation

Lenovo has once again pushed the boundaries of laptop technology with the introduction of the ThinkPad P1 Gen 7. Building upon the success of its predecessor, the 2024 iteration of the ThinkPad P1 Gen 7 boasts a new chassis, Intel Meteor Lake processor options, and an enhanced workstation GPU for the top-tier model. With the 2023 version receiving a commendable rating of 92%, anticipation is high for what the latest model has to offer. One of the most groundbreaking features of the ThinkPad P1 Gen 7 is its utilization of the LPCAMM2 module from Micron, a first in the laptop world. LPCAMM, or "low-power compression attached memory module," addresses the limitations of traditional SO-DIMM and soldered LPDDR memory solutions. By incorporating LPDDR and DDR memory chips operating in a dual-channel model, LPCAMM2 not only enhances speed and efficiency but also offers user-replaceable capabilities, unlike soldered LPDDR chips. Lenovo claims that the up to 64 GB LPCAMM2 module inside the ThinkPad P1 Gen 7 saves a significant 64% space compared to DDR5 SO-DIMM memory, while also requiring 61% less "active power." Furthermore, users have the option to equip the ThinkPad P1 Gen 7 with a massive 8 TB of storage through two 4 TB drives arranged in RAID 0/1 configuration. Performance-wise, the ThinkPad P1 Gen 7 can be configured with up to an Intel Core Ultra 9 185H CPU with vPro. Additionally, Lenovo offers the flexibility of choosing between regular gaming GPUs or upgrading to an RTX 4070 laptop GPU. In terms of display, the ThinkPad P1 Gen 7 features a 16-inch 16:10 panel, with the option for a touch-capable OLED screen boasting a 3,840 x 2,400 resolution, 100% DCI-P3 coverage, and 400 nits of brightness. Lower-end variants offer 100% sRGB IPS displays in 1600p and 1200p options with 500 and 400 nits of brightness, respectively. The ThinkPad P1 Gen 7 also impresses with its port selection, including two Thunderbolt 4 ports, one Type-A port, HDMI 2.1 output, and an SD card reader. With an entry price of 2,450 EUR ($2,621), the Lenovo ThinkPad P1 Gen 7 will be available for purchase starting in June 2024, promising consumers a leap forward in laptop innovation.

New High-end Entry in AMD's Instinct lineup Emerges

 

purely illustrative image

In recent developments reported by TrendForce, the landscape of export controls has undergone a significant expansion, encompassing not only previously restricted AI chips from industry giants NVIDIA and AMD but also their forthcoming next-generation successors. Notable additions to the list include NVIDIA's H200, B100, B200, GB200, and AMD's MI350 series, extending the scope beyond the previously known NVIDIA A100/H100, AMD MI250/300 series, NVIDIA A800, H800, L40, L40S, and RTX 4090.

In response to these regulatory changes, manufacturers in the High-Performance Computing (HPC) sector have swiftly adapted by developing products compliant with the new Trade Partnership Program (TPP) and Product Development (PD) standards. Notably, NVIDIA has introduced adjusted versions of their H20, L20, and L2 models, ensuring they remain eligible for export, thus navigating the evolving regulatory landscape.

The revelation of AMD's MI350 series suggests a refresh or potentially a new chip based on the advanced 4nm architecture, slated for launch in the latter half of this year. This underscores the industry's ongoing shift towards more advanced semiconductor technologies. It's worth noting that while the industry appears to be largely stuck at the 4nm node, Apple has made headlines by making the leap to 3nm despite challenges with low yields. This divergence in technological trajectories adds an intriguing dimension to the competitive dynamics within the semiconductor sector, emphasizing the importance of innovation and agility in navigating regulatory and technological landscapes alike.

Source: trendforce.com

[Leak] - Ryzen 5 7600x bate 12900k em benchmarks, sendo 22% mais rápido.

A CPU Ryzen 5 7600X Hexa-Core baseado em Zen 4 da AMD apareceu mais uma vez e, desta vez, foi comparada no software UserBenchmark. A amostra(sample) de CPU "Zen 4" de 6 núcleos destruiu o i9-12900K da Intel em desempenho focado em single core, e foi até 23% mais rápido Multi-Threaded Versus o antecessor 5600X.

A CPU AMD Ryzen 5 7600X "Zen 4" apareceu dentro do banco de dados UserBenchmark e foi descoberta pela TUM_APISAK. De acordo com as informações disponíveis, o chip é uma amostra de engenharia com id '100-000000593-20_Y' da OPN. O mesmo chip tinha aparecido anteriormente dentro do benchmark da GPU Basemark rodando em uma placa-mãe Gigabyte X670E. A última entrada mostra o chip rodando na placa-mãe NZXT B650 que é fabricada pela ASRock. A plataforma estava rodando dois módulos de memória de 16 GB DDR5-4800 Em termos de desempenho, enquanto o UserBenchmark é conhecido por ser tendencioso em relação às CPUs Intel, o chip AMD Ryzen 5 7600X ainda supera o principal Core i9-12900K da Intel em testes single-core. O Ryzen 5 7600X obtém um impressionante 243 pontos, enquanto o Intel Core i9-12900K obtém uma média de 200 pontos. Este é um aumento de desempenho de um único fio 20% maior. Em comparação com o Ryzen 5 5600X, o chip Zen 4 oferece um aumento de desempenho de 55% nos testes de um só núcleo. De acordo com os rumores, As CPUs baseadas em Zen4 serão reveladas na primeira semana de agosto em um evento especial junto com as fabricantes de placas mae.

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